日 期：97年3月4日（星期二） 地 點：工業技術研究院51館3A會議室 (新竹縣竹東鎮中興路四段195號51館) 主辦單位：工業技術研究院電子與光電研究所 講 師： (1) JEAN-CHRISTOPHE ELOY, General Manager of Yole Development, France. ‧JC Eloy has created and is managing Yole Développement in term of international development and strategic orientations of the company. He is in charge of the MEMS activities at Yole Développement. ‧He has performed more than 100 actions or analysis for the different customers of Yole Développement (from materials and equipment to devices and modules). (2) JEROME BARON, Technology Marketing Analyst, MEMS & Advanced Packaging ‧He has been involved in the analysis of the 3D Packaging & MEMS market evolution at device, equipment and material suppliers’ level. ‧He has performed more than 20 different market analysis for different players such as LAM Research, Infineon, Dalsa Semiconductor, Tokyo Electron, CEA/Leti and NEDO.
09:00~09:05 Opening 09:05~09:20 Introduction to Yole Development and its 3D IC & TSV Market Research Activity 09:20~09:50 Overall Roadmap for 3D IC & TSV Integration 09:50~10:20 Market Forecast Model for 3D ICs 10:20~10:40 Break 10:40~12:00 Technology Roadmaps & Market Drivers Per Application (CMOS Image Sensor, RF-SiP, MEMS, DRAM, Flash, Logic...)(I) 12:00~13:30 Lunch 13:30~14:50 Technology Roadmaps & Market Drivers Per Application (CMOS Image Sensor, RF-SiP, MEMS, DRAM, Flash, Logic...)(II) 14:50~15:30 Cost Model For 3D Packaging With TSV 15:30~15:50 Break 15:50~16:20 3D Packaging Infrastructure Readiness, Perspective & Conclusions 16:20~16:30 Q&A
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